Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC
assembly,Cable assembly,Mix technology assembly and Box-buildings.
Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;
BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.
Capabilities overview:
| Layers: | Rigid PCB 2 - 40 + Layers, Rigid-flex PCB 1 - 10Layers |
| Panel Size(max): | 21" x 24" |
| PCB Thickness: | 0.016" to 0.120" |
| Line & Spaces: | 0.003" / 0.003" Inner Layers; 0.004" Outer Layers |
| Hole Size: | 0.006" Thru Hole (Finished Size) and 0.004" Buried Via |
| Materials: | FR4, High Tg, Rogers, Halogen-free material, Teflon, Polyimide |
| Surface Finishes: | ENi/IAu, OSP, Lead-free HASL,Immersion Gold/Silver, Immersion Tin |
| Special Products: | Blind/ Buried Via(HDI 2+N+2), Rigid Flex |
Communication is the most important downstream application field of PCB. PCB has a wide range of applications in various aspects such as wireless network, transmission network, data communication and fixed network broadband, and it is usually added value such as backplane, high-frequency high-speed board, and multi-layer PCB board. Higher product. 5G is the next generation mobile communication network, and there will be a large amount of infrastructure construction demand by then, which is expected to greatly boost the demand for communication boards.
Here are the most common applications of the telecommunication industry that make efficient use of PCBs:
- Wireless communication systems
- Mobile phone tower systems
- Telephonic switching systems
- PBX systems
- Industrial wireless communication technology
- Technology for commercial phones
- Video conferencing technologies
- Communication technology used in space
- Cell transmission and tower electronics
- High speed servers and routers
- Electronic data storage devices
- Mobile communication systems
- Satellite systems and communication devices
- Video collaboration systems
- Land wired communication systems
- Technology for commercial phones
- Digital and analog broadcasting systems
- Voice over Internet Protocol (VoIP)
- Signal boost systems (online)
- Security technology and information communication systems
PCB Requirements
Communication devices require PCBs to provide robust and reliable connectivity solutions for complex high speed components. Signal integrity needs to be maintained as signals travel between transceivers, antennas, power amplifiers and more. These requirements generally include:
- High-Frequency Performance
Many communication device signals operate at high frequencies in the microwave band. For example, smartphones incorporate multiband antennas that support 4G and 5G frequency bands – 700 MHz to 5 GHz for the latest generation. This requires PCB materials and construction to enable proper signal transmission without degradation through dielectric power loss or leaky RF conduction paths. We carefully select substrates and lamination materials tailored for high frequency operation based on dielectric constant, loss tangent, thermal conductivity, TCE and other parameters. - High Speed Signal Handling
In addition to frequency, data rate throughput capacity is equally important. Cutting-edge phones with multi-Gbps Wi-Fi 6 speeds, high bandwidth wireless interfaces need PCBs with fine line traces and spaces (4-6 mil line/space is common for data lines). Short signal paths routed close together require low loss, tight impedance tolerance laminates as well as careful stackups for characteristic impedance control. And a robust power distribution network is key for clean power delivery to signal ICs and FPGAs operating at high clock rates. We design layer counts, trace dimensions, dielectrics and laminate materials specifically to maintain signal integrity in high speed signal paths. - EMI and Crosstalk Prevention
With complex components in close proximity and interacting at high frequencies, communication PCBs must prevent unwanted coupling between traces. Short signal return paths, reference planes and proper component placement facilitate field confinement. Our engineers utilize careful stackup symmetry, selective isolation/shielding around sensitive components, ground stitching vias alongside traces, and special treatments to eliminate EMI emission and minimize crosstalk in dense layouts with high speed traces throughout multilayer boards.
Quality and Reliability
Delivering the highest reliability PCB solutions for mission-critical communication systems demands strict process and quality management upholding industry standards. As an ISO 9001 certified manufacturer, we’ve implemented robust infrastructure spanning materials qualification to volume fabrication monitoring:
- IPC Standards
We benchmark quality against IPC J-STD-001, IPC-A-600 and other widely adopted PCB quality specifications. Audits of our facilities verify standard classes conformance through acceptance testing of fabricated boards as well as process reviews targeting continual improvement per IPC guidelines. IPC certifications validate disciplined, optimized fabrication workflows. - Advanced Quality Planning
Reliability risks are systematically identified during NPI through process controls selection, PFMEA/DRBFM and test vehicle measurements establishing performance baselines. We tailor process qualification, verification testing and QA sampling plans per customer requirements and design risk assessments. Each producible design has associated quality plan generating 1st pass yields. - Traceability
Raw materials receipt to finished boards shipped are tracked by ERP software tools with batch/lot traceability. Barcode work orders follow boards through process documenting each fabrication, inspection and test operation in our secured database. Complete traceability with records retention delivers the transparency customers expect from their trusted PCB producers.
